Dimensional and profile scanners gather two-dimensional (2D) or three-dimensional (3D) information about an object

Dimensional gages and instruments provide quantitative measurements of product or component dimensional and form attributes such as wall thickness, depth, height, length, inner diameter (ID), outer diameter (OD), taper or bore.

Specialty or proprietary gages, instruments or gaging systems for dimensional measurement.

Surface profilometers are contact or non-contact instruments used to measures surface profiles, roughness, waviness and other finish parameters.

Surface metrology equipment is used to measure the surface finish and/or geometry of engineering components. Surface texture and topology characteristics include surface roughness, contour, form, waviness and defects.

Image scanners are devices that scan two-dimensional (2D) objects and convert them into digital images

Scanning, OCR and imaging software is used in optical and document scanners, specialized imaging equipment, and optical character recognition (OCR) systems. Products are used to digitize, create, edit or evaluate images

Form gages and form gaging systems are used to inspect parameters such as roundness, angularity, squareness, straightness, flatness, runout, taper and concentricity. 

Laser cutting machines, laser welding machines and laser marking systems use high-powered lasers to cut, trim, perforate, weld, or join a variety of materials in plate or sheet form.

Laser optics, heads and beam delivery components are used in laser cutting machines, laser welding and marking systems.

Imaging workstations are vision systems used for metrology or image analysis in laboratory and cleanroom settings.

Surface area and pore size analyzers are used to measure surface area and pore size of a sample.  Surface area helps determine such things as how solids dissolve, burn, and react with other materials; pore size is often a secondary determination of surface area analyzers.

Antennas are structures or devices used to collect or radiate electromagnetic waves.

Dimensional measurement and metrology services use mechanical gaging, CMM measurement, non-contact imaging or other specialized methods to inspect and measure part dimensions and geometry.

Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.