The Roto-Grip is Valley Craft's clamping, rotating portable drum handlers designed to lift, transport and/or rotate drums in the tightest of spaces. The unique design of the Roto-Grip Drum Handler makes it possible to lift and rotate drums and cylinders ranging from 18" to 24" in diameter without manually clamping and releasing the cylinders. (read more)

The bright solution to simulate devices

SPEA H3500 pick & place handlers are designed for engineering, pre-production and production volumes of surface mount devices, with 2x2 to 40x40 mm size. They pick the components from trays, place them for mechanical stimulus and test and, at the end of the test, can put them in different stacks according to the test result (Pass/F... (read more)

SPEA H1000 is a series of modular handlers designed to supply a flexible and cost-effective equipment for the test of devices in reel. It is a turn key solution that integrates automation and test in a unique equipment, with a very small footprint.

The wide range of modules can be easily composed according to the specific requirements, and the open architecture allows a quic... (read more)

Today's technology companies continue to demand extremely thin silicon wafers and die for their complex applications. The Syagrus Systems team has over 12 years of silicon wafer thinning and wafer backgrinding experience. (read more)

Hermann, MO- Laser Light Technologies, Inc developed a range of approaches in laser micromachining photovoltaic panels and solar cells. These include isolation scribing, silicon wafer resizing, micromachining arrays of tapered and v-shaped grooves, laser drilling of via holes using fundamental and frequency multiplied YAG lasers and XY precision stages. (read more)

Etched Foil Heaters for the Semiconductor & Wafers industries from Thermal Circuits. In the early 1980's, Thermal Circuits introduced HTB etched foil element heaters to the Semiconductor industry to heat acid in portable wafer processing baths. It replaced hot plates that only heated from the bottom. (read more)

The Proforma 300 TM wafer thickness gage can be used to measure thickness, bow and TTV on all wafer materials including: silicon,gallium-arsenide,indium phosphide and germanium without recalibrating or electrically grounding the wafer. (read more)

Proforma 300/G - Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape. (read more)

Proforma^TM AutoScan 200 - Fully automated wafer characterization system for measuring thickness, TTV, bow, warp, bulk resistivity, site and global flatness. The Proforma AutoScan 200 features pick and place robotics, laser cassette scanning, auto-sensing cassette stands for wafers 75 - 200 mm diameter, and a modular design for easy upgrades. (read more)

Syagrus Systems' fully automated wafer dicing systems consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems they know that a good wafer dicing process sets the pace for all remaining operations. (read more)