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Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
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Products/Services for dicing
...hardware from mechanical processes are also available. Sectioning blades consist of very thin superabrasive wheels that are used to slice boules into semiconductor wafers, dice processed wafers into integrated circuit chips or dies, cut optical... Search by Specification | Learn More about Cutoff Wheels and Abrasive Saw Blades
...equipment. Other semiconductor equipment repair services repair, rebuild or refurbish die bonders; cleaning and washing equipment; dicing equipment; die separators; lithography systems; packaging equipment; wafer coating equipment; wafer bonding... Learn More about Semiconductor Equipment Repair Services
Crushers and mills are used to reduce chemicals, materials or other products to a desired particle or aggregate size range. Search by Specification | Learn More about Crushers and Mills
Pulverizers are machines that grind materials into fine powders, tiny shards, shapes, or granules on a continuous basis. Often, they are used to process items that are 2 inches (5 cm) in size Search by Specification | Learn More about Pulverizers
Electronic packaging and integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices. Learn More about Electronic and IC Packaging Services
Saw blades are cutting implements used in conjunction with saws and other cutters. Learn More about Saw Blades
Laser cutting services use industrial-grade lasers to cut metals, plastics, rubber, glass, stone, foam, and composite materials. Laser cutting is a CNC-controlled, non-contact, thermal process that provides quick, accurate cuts with a narrow kerf or cutting groove. Search by Specification | Learn More about Laser Cutting Services
Superabrasives and diamond wheels include grinding wheels, abrasive saw blades, wheel dressers, single-point tools, and other products that use diamond or cubic boron nitride (CBM) abrasive grains. Search by Specification | Learn More about Superabrasives and Diamond Wheels
Abrasives and abrasive products are used to remove surface materials such as metal, ceramics, glass, plastics, and paint. Abrasives and abrasive products include discs, belts, blast machines and sandblasters, as well as sheets, rolls, and hand pads. Search by Specification | Learn More about Abrasives and Abrasive Products
Bonded abrasives consist of conventional abrasive grains held together in a matrix of glass, resin, rubber or other binders. This classification includes grinding wheels, cut-off wheels, honing stones, mounted points and grinding segments. Search by Specification | Learn More about Bonded Abrasives
MEMS foundry services suppliers design and manufacture microelectromechanical devices on a contract basis, in prototype to production quantities. Search by Specification | Learn More about MEMS Foundry
RF transistors are designed to handle high-power radio frequency (RF) signals in devices such as stereo amplifiers, radio transmitters, and television monitors. Search by Specification | Learn More about RF Transistors
IC voltage regulators are three-terminal devices that provide a constant DC output voltage that is independent of the input voltage, output load current, and temperature. IC voltage regulators are used in power supplies that hold their output voltage constant over a wide range of load variations. Search by Specification | Learn More about IC Voltage Regulators
Power MOSFETs are majority carrier devices which have high input impedance and do not exhibit minority carrier storage effects, thermal runaway, or secondary breakdown. Power MOSFETs have higher breakdown voltages than bipolar junction transistors (BJTs) and can be used in higher frequency applications where switching power losses are important. Search by Specification | Learn More about Power MOSFET
Small-signal bipolar transistors (BJT) are semiconductors that amplify small AC or DC signals. They consist of a base n-type or p-type layer sandwiched between emitter and collector layers of the opposite type. Search by Specification | Learn More about Small-signal Bipolar Transistors (BJT)
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Precision Toolroom Cut-off Wheels Saint-Gobain Abrasives - Carborundum
Norton Charger Plus Depressed Center Wheels Norton Abrasives
Zip™ High Performance Cut-Off Wheels J. Walter Inc.
Norton Right Angle Reinforced Cut-off Wheels Norton Abrasives
High Speed Reinforced Cut-off Wheels Norton Abrasives
Norton Construction Products Norton Abrasives
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Product News for dicing
New Pressure Sensor Die Products Added
These pressure measurement dice from Intersema are used to measure pressure in a variety of applications including level measurement, tank measurement, dive computing and automotive applications such as tire pressure, brake pressure, and engine control. These die are for sophisticated users who have strong technical abilities to use such devices. (read more)
Full Services Laser House
Laser Services is a full-service laser house providing a wide variety of materials-processing services. With a fully equipped facility—including 25 modern CNC CO2 and YAG lasers— and over 40 trained professionals, we are your resource for laser scribing, etching, drilling, cutting and welding. (read more)
Mini position sensor+encoder: 0.5micron resolution
Now with higher resolution and smaller (chip-scale) packaging, the "world's smallest linear encoder" offers robust, precise positioning for miniature imaging systems, consumer electronics, precision biomedical devices, optical instrumentation and more... (read more)
1W High Power LED
Lens Color: Water Clear
Lens Diffusion: Non-Diffusion
Dice Source: GalnN/GaN
Color Temperature: 3300K (read more)
Henion Dicers
The HENION dicer is not only excellent for dicing compounds and heavily loaded concentrates, but is gaining a reputation for reclaim of processing scrap. Edge trim, rejected sheets can be re-diced, reclaiming the scrap into pellets that have the same characteristics as the original compound. (read more)
Packaging Blades from Specialty Blades
Whether your food blade is a simple circular slicing blade, a potato chip blade, a custom serrated dicing blade, or a wear-resitant blade used in a food packaging application; a perforating machine knife, a custom serrated corrugated blade, a hot knife, or a wear-resistant blade used in a form, fill and seal application, specifying the right blade makes all the difference. (read more)
Neon-CL FrameGrabber-High Performance/Low Cost
BitFlow's Neon-CL CameraLink/PoCL framegrabber is designed for the OEM that needs the performance of the PCI Express bus, BitFlow's famous industrial quality, and one of the lowest price points in the industry. (read more)
Precision Glass Machining
IRD specializes in the manufacture of technical and optical glass and ceramic components made from a wide range of raw materials. They excel at holding extremely precise tolerances to help customers solve problems resulting from excessive variation. (read more)
Medical Device Glass and Ceramic Components
IRD manufactures a variety of custom glass and ceramic components for the medical industry. Custom slides, probe tips, nozzles and cutting blades, if precision is part of your requirements, IRD should be your first stop. (read more)
ICROS® TAPE
ICROS® TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. (read more)
Parts by Number for dicing
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| RES18K2% DICE | netCOMPONENTS | Not Provided | Not Provided | Not Provided |
| RES39K1% DICE | netCOMPONENTS | Not Provided | Not Provided | Not Provided |
| RH1021C-5 DICE | netCOMPONENTS | Not Provided | Not Provided | Not Provided |
| TX-2B DICE | netCOMPONENTS | Not Provided | Not Provided | Not Provided |
| AIC1863CD-3 DICE | netCOMPONENTS | Not Provided | Not Provided | Not Provided |
Conduct Research
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TA015: Dicing Improvements: Yield Enhancement, Throughput Increase and Die Size Reduction
A strong wafer dicing operation is vital to the manufacturing process. At the dicing stage the wafer has the highest value. Everyone is aware of the wafer and die yield for the lot and they are...(read more)
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Semiconductor Manufacturing Handbook
As engineers, technologists, managers, professors, or students, we are all facing increasing challenges in a cross-functional manufacturing environment. For each project, we must consider: What are...(read more)
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Semiconductor Micromachining Using Diode-Pumped Solid-State Lasers
Laser micromachining of semiconductor materials such as silicon and sapphire has attracted more and more attention in recent years. High precision laser cutting and drilling processes have been...(read more)
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Diode Detector Simulation using EEsof ADS Software - App Note
This application note has been written to demonstrate how the Avago Technologies EEsof ADS software package can be used to simulate a diode detector circuit reliably against temperature. For this...(read more)
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Spinning Mass Mechanical Gyroscopes
In early times, people discovered the spinning top, a toy with a unique ability to balance upright while rotating rapidly. Ancient Greek, Chinese and Roman societies built tops for games and...(read more)
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LVP's Speed Capacity Pays for Machine
AccuBurn's plate-burning division was started by Marcus McGowan eight years ago with one plasma machine in a borrowed corner of the shop's facility. The business grew rapidly into today's 25,000...(read more)
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Using the Microchip Endurance Predictive Software
Endurance, as it applies to non-volatile memory, refers to the number of times an individual memory cell can be erased and/or written (some architectures do not erase before every write). Advances in...(read more)
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American Precision Dicing, Inc. - Quick turn wafer dicing APD IS PROUD to be one of the fastest quick turn dicing shops in the world, filling a critical customer need for fast, high quality work. See American Precision Dicing, Inc. Information |
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Dicing Saws - Equipment Acquisition Resources Inc. Dicing Saws Disco Dicing Saws Kullicke and Soffa Dicing Saws See Equipment Acquisition Resources, Inc. Information |
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Dicing Blade Technology Dicing Blade Technology provides a line of premium blades and accessories for most dicing applications. See Dicing Blade Technology Information |
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Dicing Blades - SMART CUT technology Dicing Blades Wafering Blades Diamond Drills Diamond Dicing Drilling & Micro Drilling See UKAM Industrial Superhard Tools Information |
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Dicing Blades - SMART CUT technology SMART CUT series Metal Bond Diamond Dicing Blades are the first universal dicing blades you can find on the market. See UKAM Industrial Superhard Tools Information |
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Veeco - ADS-800 Advanced Dicing System Optium Lapping/Dicing Systems Optium ADS 160 Advanced Dicing System See Veeco Instruments Profile & Catalog |
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Dicing Saw | Blades - Thermocarbon Inc. HOME DICING BLADES DICING SAW FLANGES-SPACERS ABOUT-US CONTACT-US Tcar-864-1 Dicing Saw / Wafer Saw Machine Capabilities and overview. See Thermocarbon, Inc. Information |
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Dicing Blades | Diamond Blades - Thermocarbon Inc. HOME DICING BLADES DICING SAW FLANGES-SPACERS ABOUT-US CONTACT-US Resin-bonded Diamond Dicing Blade and Diamond Blade Information Page See Thermocarbon, Inc. Information |
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Dicing - Wikipedia, the free encyclopedia Dicing From Wikipedia, the free encyclopedia Dicing is a method of food preparation in which the food item is cut into small blocks or dice. |
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Resources: Dicing/Sawing Services Wafer Dicing Wafer dicing or sawing services are available to Stanford University researchers at the Ginzton Applied Physics Lab Crystal shop. |
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