Achieve 0.1 micron resolution, 3 Dimensional (3-D) metrology, and inspect both sides of the wafer simultaneously in a system that is SECS/GEM compliant and is compatible with Class 10 or above Clean Room Applications. (read more)

Syagrus Systems offers automated wafer inspection services as well as the flexibility of manual wafer inspection services. Whether you have unsawn wafers, sawn wafers on frame or individual die, our trained staff can help you. Inspection personnel are trained to MIL STD 883 specifications. For products with less stringent requirements, a commercial grade die inspection is available. (read more)

Today's technology companies continue to demand extremely thin silicon wafers and die for their complex applications. The Syagrus Systems team has over 12 years of silicon wafer thinning and wafer backgrinding experience. (read more)

This machine uses high performance machine vision to inspect the precision alignment of small components attached to a silicon wafer. (read more)

The Proforma 300 TM wafer thickness gage can be used to measure thickness, bow and TTV on all wafer materials including: silicon,gallium-arsenide,indium phosphide and germanium without recalibrating or electrically grounding the wafer. (read more)

Steinmeyer, Inc. announced a new precision linear stage model KDT450-205-SM-L. (read more)

Syagrus Systems' fully automated wafer dicing systems consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems they know that a good wafer dicing process sets the pace for all remaining operations. (read more)

The Prior Scientific motorized Shuttle Stage is designed to be used with the Nikon and Olympus wafer loader systems for 3, 4, 6, and 8 inch wafers. The system greatly reduces operator fatigue while increasing inspection accuracy and repeatability. (read more)

The National Fire Protection Association (NFPA) strongly recommends that aerial and ground ladder equipment be inspected on an annual basis. Inspections performed by NDT-Group will assure that equipment tested meets all state and federal safety codes, in addition to full compliance with inspection standards and recommendations. (read more)

Attach small, thin components to wafer with better than 1 micron accuracy, 99.9% quality, and self-inspection in 1.25 seconds.

This machine attaches small, thin components to the surface of a wafer using vision-guided servo control, 2 robots, a high performance stack of stages (X, Y, Theta), 4 vision cameras, and 2 vision boards. (read more)