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Product Alerts
Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
Thickness gages are used to make precise dimensional measurements on a wide variety of coatings and materials including steel, plastic, glass, rubber, ceramics, paint, electroplated layers, enamels, etc Search by Specification | Learn More about Thickness Gages
Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing. Search by Specification | Learn More about Wafer and Thin Film Instrumentation
Measurement microphones are most commonly condenser microphones, which convert sound pressure to an output that is then converted into a reading such as sound pressure level (SPL). Search by Specification | Learn More about Measurement Microphones
Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers. Search by Specification | Learn More about Semiconductor Metrology Instruments
Semiconductors (metalloids) or semiconductor materials are used to fabricate microelectronic and optoelectronic devices such as transistors, photodetectors or solar cells. Learn More about Semiconductors and Semiconductor Materials
Dimensional gages and instruments provide quantitative measurements of product or component dimensional and form attributes such as wall thickness, depth, height, length, inner diameter (ID), outer diameter (OD), taper or bore. Search by Specification | Learn More about Dimensional Gages and Instruments
...methods. Eddy current instruments induce detectable eddy currents in conductive materials, providing information for applications such as flaw detection, thickness determination, weld inspection, conductivity measurement, alloy sorting, and heat... Search by Specification | Learn More about Nondestructive Testing (NDT) Material Testers
Dimensional measurement and metrology services use mechanical gaging, CMM measurement, non-contact imaging or other specialized methods to inspect and measure part dimensions and geometry. Search by Specification | Learn More about Dimensional Measurement and Metrology Services
...that use HeNe lasers are used in alignment, recording, printing, and measurement applications. HeXe lasers use a mixture of helium and xenon. Interferometers also differ in terms of number of axes (single or multiple), orientation (vertical or horizontal... Search by Specification | Learn More about Interferometers
Humidity measurement instruments test for absolute humidity, relative humidity, or dew point in air. Search by Specification | Learn More about Humidity Measurement Instruments
Although most surface profilometers provide only a two-dimensional (2D) or line file, some instruments can provide three-dimensional (3D) or areal topography measurements. Surface profilometers differ in terms of measurement capabilities... Search by Specification | Learn More about Surface Profilometers
...environments. Air metrology instruments can provide comparative or quantitative measurements such as thickness, depth, internal diameter (ID), outer diameter (OD), bore, taper and roundness. Air gauges and gaging systems may also use an indicator... Search by Specification | Learn More about Air Gages
...dimensional (3D) or areal topography measurements. In this way, 2D or 3D roughness and waviness parameters are calculated from profile data. Form gages and form gaging systems are used to measure coaxiality, cylindricity, taper, flatness... Search by Specification | Learn More about Form Gages and Form Gaging Systems
Plating equipment and anodizing equipment is used to apply a finish to a products to increase its durability or to resist corrosion. Learn More about Plating and Anodizing Equipment
Web sensing systems and web scanning systems employ a variety of sensors that scan across a moving web to detect defects and measure parameters such as product basis weight, thickness and moisture. Learn More about Web Sensing and Scanning Systems
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Non-Contact Wafer Thickness Gage MTI Instruments Inc.
Copper Thickness Measurement - PHASCOPE PMP10 Fischer Technology, Inc. / Coating Thickness Gages
Series 35 Ultrasonic Precision Thickness Gauges Olympus - NDT
Corrosion Thickness Measurement Gauges Spectrum Instruments Ltd.
New Coating Thickness Gauges CMI153 and CMI250 Oxford Instruments / Industrial Analysis
DUALSCOPE® FMP100 COATING THICKNESS GAUGE Fischer Technology, Inc. / Coating Thickness Gages
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Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates diameters 75 - 300 mm. (read more)
ProformaTM AutoScan 200 - Fully automated wafer characterization system for measuring thickness, TTV, bow, warp, bulk resistivity, site and global flatness. The Proforma AutoScan 200 features pick and place robotics, laser cassette scanning, auto-sensing cassette stands for wafers 75 - 200 mm diameter, and a modular design for easy upgrades. (read more)
The Proforma 300SA is a semi-automated tool for measuring wafer bow, warp, flatness and stress. (read more)
The Proforma 300 TM wafer thickness gage can be used to measure thickness, bow and TTV on all wafer materials including: silicon,gallium-arsenide,indium phosphide and germanium without recalibrating or electrically grounding the wafer. (read more)
Proforma 300/G - Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape. (read more)
Laser Sensor Displacement & Position Measurements from MTI Instruments.
The Microtrak II features state-of-the-art CMOS laser triangulation sensing technology for precise measurements of displacement, position, vibration and thickness. (read more)
Solar Wafer Thickness Tool from MTI. The PV-1000 is a High speed, multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials. (read more)
PHASCOPE® PMP10 measures copper coating thickness using phase-sensitive Eddy current method. It is a user-friendly instrument providing reproducible and accurate measurement of copper thickness on PC boards and metallic coatings on ferrous and non-ferrous metallic or electrically non-conductive parts. Depending on the probe it operates at the frequencies of 60 kHz, 240 kHz or 1.25 MHz. (read more)
With thickness and topographical measurement speeds up to 4000 measurements per second, CHRocodile E is ideal solution for your non-contact inspection problems. (read more)
Measurement of copper thickness on printed circuit boards. Non-destructive, fast, accurate, and without influence from opposing copper layers. (read more)
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MTI Instruments | Precision Instruments | Non-contact... We also offer wafer thickness gaging instruments, noncontact gages and displacement probes and sensors for edge and repetitive and nonrepetitive |
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Automated Semiconductor Wafer Sorting Using NI LabVIEW... Measuring the bow, warp, and TTV of a wafer requires performing a full dimensional measurement scan of the wafer top and bottom surfaces. |
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MEMS Calculator or fixed-fixed beams, and a material test machine is used to obtain the wafer bond strength from micro-chevron test structures. See Electronics and Electrical Engineering Laboratory Information |
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Prometrix FT-700 Wafer Film Thickness Measurement-Surplus... >> Prometrix FT-700 Wafer Film Thickness Measurement Category >> New Arrivals >> Prometrix FT-700 Wafer Film Thickness Measurement Prometrix FT-700 See SPEC Equipment - Surplus Process Equipment Corporation Information |
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SEMI P27-96 (Reapproved 0703) Parameter Checklist for... |
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SEMI MF576-0706 Test Method for Measurement of Insulator... |
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In-line FTIR for epitaxial silicon film thickness measurement... In-line FTIR for epitaxial silicon film thickness measurement on an Applied Materials Centura cluster tool |
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In-situ film thickness and temperature monitoring using a 2... IEEE 1991 Item Title: In-situ film thickness and temperature monitoring using a 2 GHz acoustic phase measurement system Publisher Name: IEEE |
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Spectrophotometric film thickness measurement: View Spectrophotometric film thickness measurement: View Spectrophotometric film thickness measurement See MEMS and Nanotechnology Exchange Information |
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Spectrophotometric film thickness measurement: View Spectrophotometric film thickness measurement: View Spectrophotometric film thickness measurement See MEMS and Nanotechnology Exchange Information |