Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.  

Surface metrology equipment is used to measure the surface finish and/or geometry of engineering components. Surface texture and topology characteristics include surface roughness, contour, form, waviness and defects

Dimensional measurement and metrology services use mechanical gaging, CMM measurement, non-contact imaging or other specialized methods to inspect and measure part dimensions and geometry

Material testing services test, analyze, and certify a wide range of materials for purity, chemical compatibility, and environmental impact.

Wafer and thin film instrumentation includes quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, and C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing

Coating equipment is used to apply organic, inorganic or metal coatings onto part surfaces for industrial applications

Interferometers measure distance in terms of wavelength and determine the wavelengths of light sources.

Form gages and form gaging systems are used to inspect parameters such as roundness, angularity, squareness, straightness, flatness, runout, taper and concentricity. 

Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation

Machine vision systems are used for automated inspection and measurement in production environments.

Surface profilometers are contact or non-contact instruments used to measures surface profiles, roughness, waviness and other finish parameters.

Dimensional gages and instruments provide quantitative measurements of product or component dimensional and form attributes such as wall thickness, depth, height, length, inner diameter (ID), outer diameter (OD), taper or bore.

Coordinate measuring machines (CMMs) are mechanical systems designed to move a measuring probe to determine the coordinates of points on a work piece surface.

Imaging workstations are vision systems used for metrology or image analysis in laboratory and cleanroom settings

Dimensional and profile scanners gather two-dimensional (2D) or three-dimensional (3D) information about an object.