Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation

Wafer and thin film instrumentation includes quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, and C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing

Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.  

Dimensional measurement and metrology services use mechanical gaging, CMM measurement, non-contact imaging or other specialized methods to inspect and measure part dimensions and geometry

Material testing services test, analyze, and certify a wide range of materials for purity, chemical compatibility, and environmental impact.

Surface metrology equipment is used to measure the surface finish and/or geometry of engineering components. Surface texture and topology characteristics include surface roughness, contour, form, waviness and defects

Coating equipment is used to apply organic, inorganic or metal coatings onto part surfaces for industrial applications.

Video cameras take continuous pictures and generate signals for display or recording. They capture images by breaking them down into a series of lines. This search form does not include consumer devices such as camcorders.

Surface profilometers are contact or non-contact instruments used to measures surface profiles, roughness, waviness and other finish parameters.

Form gages and form gaging systems are used to inspect parameters such as roundness, angularity, squareness, straightness, flatness, runout, taper and concentricity. 

Thin film process monitors are used to control thin film deposition rate or composition during processing

Thin film sources consist of magnetrons, evaporation thermal units, ion beams and other sources that produce deposition materials (vapors or ions) in a thin film system

Thin film circuits and products are metallized or plated onto ceramic substrates

Thin film coating services apply very thin layers of specialized materials to part surfaces. They perform processes such chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, electrochemical deposition (ECD), plasma etching, rapid thermal processing (RTP), and titanium nitride coating

Thin film materials are high purity materials and chemicals such as precursor gases, sputtering targets or evaporation filaments used to form or modify thin film deposits and substrates