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Wafer and thin film instrumentation includes quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, and C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing
Plating services apply a thin coating of metal to the surface of a substrate in order to improve conductivity, prevent rust and corrosion, and facilitate soldering. There are two basic plating techniques: electroplating and electroless plating
Search by Specification | Learn MorePlating and anodizing equipment is used to apply a finish to a products to increase its durability or to resist corrosion
Learn MorePlating and anodizing chemicals and supplies consist of metal salts, anodes and other consumables for the electro-deposition or electroplating of metal films or anodized layer formation
Learn MoreLaser cutting machines, laser welding machines and laser marking systems use high-powered lasers to cut, trim, perforate, weld, or join a variety of materials in plate or sheet form
Search by Specification | Learn MoreProcess development services can develop new processes, run process research and development (R&D) programs, perform optimization studies, improve current processing methods and provide other assistance in process development activities
Search by Specification | Learn MoreMaterials processing services providers manufacture mechanically or thermally process metals, ceramics, polymers, glasses or other materials on a contract basis
Search by Specification | Learn MoreThin film process monitors are used to control thin film deposition rate or composition during processing
Learn MorePlate forming services cut, roll, form, and weld metal plates, typically greater than 3/16
Learn MoreFood and beverage processing and service equipment is used to process food and beverages
Learn MoreChemical and material processing services modify or produce chemicals, powders, foods, minerals, rubber, plastics, adhesives, and other bulk materials on a contractual, toll or fee basis. Common processes include compounding, distillation, drying, formulation, mixing, blending, purification, extraction, synthesis, and powder milling
Search by Specification | Learn MoreProcess equipment and system integration services provide modular systems and components used to process fluids, oil, gases, sea water and powders. This product area includes process skids, distillation equipment, evaporators, desalination systems, secondary recovery systems, chemical injection systems, and solvent recovery systems. 
Search by Specification | Learn MoreNanoparticle and powder processing services perform milling, crushing, classifying, screening, grading, atomizing, coating, or production of metal or chemical powders and nanomaterials on a contractual basis
Search by Specification | Learn MoreMolding services create ceramic, composite, glass, rubber, plastic, silicone, or metal parts by combining solids or powders with liquids, or by pressing solid materials or powders into a die or form.
Search by Specification | Learn MoreIndustrial mixers use a shaft, screw, blades, ribbons, impellers or propellers to mix industrial materials such as adhesives, chemicals, construction materials, minerals, coatings and paints.
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Thin Film Coating Instrumentation Nor-Cal Products, Inc.
Measurement and Inspection Machines Visionx Inc.
Wafer Measurement System from MTI Instruments MTI Instruments Inc.
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TMF Tin Process
Simple immersion technique for tin plating process. Deposit pure tin onto copper, brass, other copper-based alloys, gold and lead-tin electroplate. Features:
* Plates pure tin rapidly * Plating exhibits fine-grain tin structure * Affords unusual resistance to humidity and salt-spray * Excellent solderability * Process simple to operate and maintain (read more)
Effective July '06, many countries have strict regulations regarding chrome plating. Suppliers of chrome-plated parts are expected to comply with RoHS standards. Trivalent chrome is the next generation chrome plating process, which is both environment friendly and RoHS compliant. Trivalent chrome plating helps eliminate toxic products from the electro plating process. (read more)
Elite Metal Finishing Services offers multiple electropolishing systems capable of processing both internal and external surfaces on a wide range of products including Automotive Trim, Biopharmaceutical, Food & Dairy, Medical Components and Semiconductor Products. (read more)
New environmentally friendly lead-free plating used on all PANJIT products. (read more)
Electroless Nickel (EN) is an autocatalytic plating process, in which does not require rectifiers, electrical current or anodes. It differs from electroplating, which depends on an external source of direct current to reduce nickel ions in the electrolyte to nickel metal on the substrate. (read more)
The MP50 Process Imaging Series is a family of advanced infrared linescanners providing accurate, real-time, thermal imaging for a wide variety of industrial applications, including continuous sheet and web-based processes, discrete manufacturing processes, and rotating kilns. (read more)
This Glenro industrial drying oven dries solvent-based ink on food packaging film. The drying oven allows high-speed processing without damaging the film web. The process dryer measures 40 inches long by 48 inches wide by 48 inches high. Power controls and operator interface components are built into a NEMA 12 enclosure, which includes a ventilation blower, wire ways, and number coding of leads. (read more)
A new corrosion resistant fume tight Pannevis RT filter from Larox make it possible to safely and efficiently process hazardous or toxic materials, or materials sensitive to outside contamination when the process is too corrosive for conventional materials. (read more)
Elite Metal Finishing Services' passivation processes supports high volume and one-of-a-kind parts with size and automated capabilities. (read more)
Glenro's high velocity hot air impingement industrial drying oven is used to dry a waterbased silicone finish on spunbonded polyester nonwoven web. High velocity hot air impingement speeds drying despite the web's wet pick-up. A mechanical subsystem raises the dryer's upper cap allowing complete access to the product web. It includes a complete control package and comes prewired and prepiped. (read more)
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Applied Materials, Inc. - Applied Reflexion LK CMP LK CMP system also implements a full suite of endpoint methods, in-line metrology and advanced process control capabilities that ensure excellent See Applied Materials, Inc. Information |
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Thermo Scientific - Alphabetized List of Orion 960... ABC, Alkalinity 1st endpoint ABC, Alkalinity 3rd endpoint ABC, Alkalinity, 2nd Endpoint Acetic Acid in Canned Products |
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Integrated Device Technology, Inc. 2975 Stender Way, Santa... Location Alternate Location Tin Plating Process IDT-Penang, Malaysia ISO Tech (Globetronics) Solder Dip Process Please see attachment for affected |
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Xilinx: Table 2B: Hermetic Package/Product Monitor... In-line Process Monitor #11 B12 Lead Material/Plating Thickness (Optional) PACKAGE/PROCESS CAT.1 CAT.2 CAT.3 B1 See Xilinx, Inc. Information |
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Glossary | Solid Waste and Emergency Response | US EPA Assessment Endpoint An explicit expression of the environmental value that is to be protected, operationally defined by an ecological entity and its |
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I:\03-003\...\Ch 14 final.wp [PFP#341507743 is oxidized and at least one species is reduced simul- taneously; one process cannot occur without the other. |
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Copper.org: Industrial: ANTEC Report - Undercutting Mold... Plating and Common Related Failure Mechanisms Under-Plating Porosity Performance Requirements See Copper Development Association Inc. Information |
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[No Title] Combustion Expert v4 In order to make real improvement to the fuel economy of your process, you need to know the efficiency. See American Institute Of Chemical Engineers Information |
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PF Online Web Exclusive Article - Who Really Cares About the... the same heat treatment scale, amount of lubricant or consistent surface finish, then the cleaning and plating process would be more predictable. |
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Thin-film multichip module packages for high-end IBM servers Process type by level SE/ PE/ PE/ PE/ PE Thin copper oxides on the seed are etched in the plating solution before Cu plating begins. |