Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)

Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)

Rogue Valley Microdevices provides PVD Metals including sputtered Copper, sputtered Tantalum, sputtered Titanium, sputtered Tungsten, sputtered Nickel, sputtered Chrome, and sputtered Aluminum. Our process has an in-situ RF etch that ensures good film adhesion and Ohmic contact to conductive layers. We can provide the metal barrier layers and dielectric films on wafers sizes 50mm to 300mm. (read more)

Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)

Export, PA, Summer 2009 – Oerlikon Leybold Vacuum USA has introduced the UNIVEX line of universal experimentation PVD vacuum coating systems for use in research & development and pilot production applications. (read more)

Rogue Valley Microdevices provides PVD Metals including sputtered Copper, sputtered Tantalum, sputtered Titanium, sputtered Tungsten, sputtered Nickel, sputtered Chrome, and sputtered Aluminum. Our process has an in-situ RF etch that ensures good film adhesion and Ohmic contact to conductive layers. We can provide the metal barrier layers and dielectric films on wafers sizes 50mm to 300mm. (read more)

Rogue Valley Microdevices offers E-Beam Evaporation of metal stacks including but not limited to Ti/Au, Ti/Pt, Cr/Au, and Cr/Pt. Our E-Beam Evaporation process provides excellent film thickness uniformity and is done at low temperatures that will not damage photoresist for metal lift-off. Our process capabilities allow us to deposit up to six different materials in-situ if required. (read more)

Rogue Valley Microdevices is pleased to offer you the option of PECVD Silicon Oxide. Our PECVD Oxide is a single sided film that has been optimized for wafers requiring minimal thermal processing, and is often used during the semiconductor manufacturing process to form intra-metal dielectric stacks. PECVD Oxide is also used in MEMS and Surface micro-machining processes. (read more)

Rogue Valley Microdevices is an industry leader for high quality LPCVD films. You can order LPCVD Nitride as thick as 5μm or as thin as 100Å! Low Stress LPCVD Nitride is one of our most popular films and is often used for building Membranes, Cantilever Beams and other mechanical structures. (read more)

Rogue Valley Microdevices is proud to be your leading source of high quality LPCVD Silicon Nitride films. Our LPCVD Nitride Process uses very specific gas ratios to produce a stable LPCVD Silicon Nitride film that can target a customers film stress requirements. Our engineering team is able to offer our customers the opportunity to customize Film Stress to fit their exact application. (read more)