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...systems designed for low volume experimental or analytical applications. Sputter coaters for SEM or TEM preparation would fall into this category. There are several technology choices available for thin film equipment. These include chemical vapor... Search by Specification | Learn More about Thin Film Equipment
Reactive and refractory metals include tungsten, molybdenum, niobium, tantalum, chromium, hafnium, zirconium, and titanium. Reactive metals oxide rapidly and form a stable oxide. Refractory metals and alloys have melting points above ~ 1750° C Search by Specification | Learn More about Refractory and Reactive Metals
...a precursor gas or mixture of gases into a chamber. The reaction with an energy source then forms a thin film coating. Physical vapor deposition (PVD) also uses an energy source, but for glow discharge processes such as evaporation and sputtering... Search by Specification | Learn More about Thin Film Coating Services
Materials processing services providers manufacture mechanically or thermally process metals, ceramics, polymers, glasses or other materials on a contract basis. Search by Specification | Learn More about Materials Processing Services
Impedance matching networks are electrical circuits which, when connected between two networks, match the output impedance of the source (the first network) to the input impedance of the load (the receiving or second network). The purpose of matching these two impedances is to minimize wave reflection and/or to maximize the transfer of power between the system and the load. Search by Specification | Learn More about Impedance Matching Networks
Magnetrons are high-powered vacuum tubes used to generate microwave signals. Products include cavity magnetrons and sputtering magnetrons. Learn More about Magnetrons
Thin film materials are high purity materials and chemicals such as precursor gases, sputtering targets or evaporation filaments used to form or modify thin film deposits and substrates. Learn More about Thin Film Materials
...packaging, and via forming or filling. CMP is used for the planarization of deposited structures. PVD deposits thin films by physical methods and includes techniques such as evaporation and sputtering. CVD is a thin-film deposition process in which gaseous... Search by Specification | Learn More about Semiconductor Foundry Services
KVA meters measure the apparent power of AC devices in kilovolt-amperes (KVA). Apparent power is the combination of a circuit’s true power and reactive power. Search by Specification | Learn More about KVA Meters
...layers through evaporation or sputtering (glow discharge processes. CVD coaters feed a precursor gas or mixture of gases into a chamber where they react with an energy source, usually heat. Powder coating equipment applies heat or radiant energy to fuse... Search by Specification | Learn More about Coating Equipment
Metal rod and bar stock are metals and alloys in the form of round bars or rod, square bars, rectangular or flat bars, hexagons, and other bar stock shapes. Search by Specification | Learn More about Metal Rod and Bar Stock
Formulation, blending and compounding services perform custom or contractual processing, development, and/or packaging of bulk materials such as plastics, elastomers, adhesives, chemicals, pharmaceuticals, additives and lubricants. Search by Specification | Learn More about Formulation, Blending and Compounding Services
...existing surface. Magnetrons are a self-excited oscillator used as a radar transmitter tube. Magnetron sputtering is the most widely used process for vacuum thin film deposition. A magnetron tube is most commonly used in microwave ovens. A thin film... Learn More about Thin Film Sources
...are also available. Precious metals include silver, gold, platinum, palladium, iridium, osmium, rhodium, and ruthenium. Reactive and refractory metals include tungsten, molybdenum, niobium, tantalum, chromium, hafnium, zirconium, and titanium. Other non... Learn More about Metal Billets, Slabs and Blooms
ASTM F1711-96 describes the use of four-point probes for measuring the sheet resistance of thin film conductors in flat panel displays (FPDs). ASTM F1709-97 outlines specifications for high-purity titanium sputtering targets for electronic thin... Learn More about Thin Film Circuits and Products
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Custom Thin Film Equipment Consarc - An Inductotherm Group Company
Univex Coating Systems Oerlikon Leybold Vacuum USA Inc.
R&D/Limited Production CMP Tool Lapmaster International
In-Motion™ Solution: MEMS Package Veeco Instruments
Semiconductor Thickness -- CHRocodile MI5 Precitec, Inc.
Motorized Semiconductor Wafer Shuttle Stage Prior Scientific, Inc.
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S-Bond® active solders are a versatile bonding agent that makes the production of sputter targets easier, less costly while offering higher bond performance for most sputter target and backing plate materials. (read more)
Most sputtering target materials can be fabricated into a wide range of shapes and sizes. (read more)
Testbourne Ltd is proud to announce its new range of rotatable sputtering targets. The rotatable targets are produced by either plasma spraying onto a base tube or from solid pieces. Lengths of over 1000 mm are manufactured. (read more)
Indium Corporation's OnSpec CIG alloy sputtering targets, made from copper (Cu), indium (In), and gallium (Ga), are used to produce high-effi ciency CIGS (Cu/In/Ga/di-selenide) solar cells. CIG targets offer tight control of the final solar cell composition. This is due to our unique process that results in a fully alloyed and completely homogenous CIG alloy (read more)
Silver is a chemical element with the symbol "Ag" and atomic number 47. (read more)
Sputtering targets can be simply clamped to the sputter source cathode inside the sputter depositing system. (read more)
ELectron Microscopy Equipment
South Bay Technology offers a complete solution for TEM specimen preparation. SBT offers systems for each stage of the preparation process from bulk material processing to low energy ion milling and plasma cleaning (read more)
Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)
Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)
Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)
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Reactive Sputtering ? The Importance of Partial Pressure... Reactive Sputtering ? The Importance of Partial Pressure Control in Reactive Sputtering by Hiden Analytical See AZoM Information |
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Reactive Sputtering Reactive Sputtering Plasma Excitation PECVD |
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Thin Film Deposition Expert & Specializing in Reactive... Expert in Thin Film Deposition, Specializing in Reactive Sputtering See Intota Information |
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Reactive Sputtering Expert for Consulting, Expert Witness reactive sputtering ? ion sputtering ? See Intota Information |
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MRS Website : Relationship between domain structure and film... Relationship between domain structure and film thickness in epitaxial PbTiO 3 films deposited on MgO(001) by reactive sputtering See Materials Research Society Information |
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Untitled Reactive Sputtering and Deposition Course: Reactive Sputtering and Deposition See AVS Information |
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Reactive magnetron sputtering of thin films: present status... Reactive magnetron sputtering of thin films: present status and trends |
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Two-step reactive sputtering of piezoelectric AlN thin films Two-step reactive sputtering of piezoelectric AlN thin films |
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Device for reactive sputtering invention Device for reactive sputtering USPTO Application #: 20050211550 Title: Device for reactive sputtering |
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Reactive sputtering zinc oxide transparent conductive oxides... Reactive sputtering zinc oxide transparent conductive oxides onto large area substrates -> Monitor Keywords |