Laser Sensor Displacement & Position Measurements from MTI Instruments.

The Microtrak II features state-of-the-art CMOS laser triangulation sensing technology for precise measurements of displacement, position, vibration and thickness. (read more)

New Surfcom 2000 and Surfcom 5000 dual measuring instruments: surface and contour in a single process (read more)

The ISOSCOPE® MP30E-S Coating Thickness Gauge measures coatings over non-ferrous substrates such as aluminum, stainless steel or zinc using the eddy current method. Any assortment of coating thicknesses can be measured with the ISOSCOPE® MP30 Coating Thickness Gauge due to the wide range of smart probes available with this instrument. (read more)

Mahr Federal has expanded its offerings in the world of optical surface metrology with the introduction of the MarSurf™ WS 1. Utilizing white light interferometry in a compact design, the MarSurf WS 1 offers vertical resolution of 0.1 nm (.004 µin) and provides three-dimensional measurement in only a few seconds. (read more)

Atomic-force microscopy (AFM) is a tool used to generate images of surface topography with nanometer spatial resolution. Surface structure and defects can be investigated, and surface roughness can be quantitatively measured. (read more)

FISCHERSCOPE® MMS® PCB: Three in one instrument A universal measurement system for pc-boards measures the thicknesses of solder resist coatings as well as copper on surface areas and in boreholes. (read more)

Before climbing up a ladder to make a measurement or touching test leads to a high voltage breaker panel or making contact with an active motor wouldn't it be safer and faster to be able to simply point your measuring device at the target area to locate a hot spot? (read more)

PHASCOPE® PMP10: Measure Copper Coating Thickness better with Eddy Current User-friendly, reproducible, accurate measurement of copper thicknesses using the phase-sensitive eddy-current method. (read more)

New compact, lightweight spectrophotometer delivers fast color measurement of challenging products/samples. With CM-700d, measurement of rounded or concaved samples become easy and repeatedly controllable. Bluetooth wireless data communication to PC or printer & the easy-to-read color LCD screen display brings color measurement to levels never experienced before (read more)

Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates diameters 75 - 300 mm. (read more)