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Product Categories for thickness wafer measurement
Thickness Gages -
(237 companies)
Thickness gages are used to make precise dimensional measurements on a wide variety of coatings and materials including steel, plastic, glass, rubber, ceramics, paint, electroplated layers, enamels, etc
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Semiconductor Metrology Instruments -
(113 companies)
Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.
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Wafer and Thin Film Instrumentation -
(261 companies)
Wafer and thin film instrumentation includes quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, and C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing
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Surface Profilometers -
(127 companies)
Surface profilometers are contact or non-contact instruments used to measures surface profiles, roughness, waviness and other finish parameters.
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Corrosion and Electrochemical Instruments -
(74 companies)
Corrosion and electrochemical instruments use a variety of methods to detect and measure corrosion and electrochemical conditions in plant machinery, field equipment, batteries, fuel cells, colloids, and other solutions or systems.
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Superabrasives and Diamond Wheels -
(271 companies)
Superabrasives and diamond wheels consist of grinding wheels, abrasive saw blades, wheel dressers, single point tools and other products utilizing diamond or cubic boron nitride (CBN) abrasive grain.
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Optical and Light Microscopes -
(169 companies)
Optical and light microscopes use the visible or near-visible portion of the electromagnetic spectrum to magnify images of objects.
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Thin Film Process Monitors -
(33 companies)
Thin film process monitors are used to control thin film deposition rate or composition during processing.
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X-ray Fluorescence Spectrometers -
(51 companies)
X-ray fluorescence spectrometers (XRFs) use a spectroscopic technique that is commonly used with solids, in which X-rays are used to excite a sample and generate secondary X-rays.
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Thin Film Materials -
(131 companies)
Thin film materials are high purity materials and chemicals such as precursor gases, sputtering targets or evaporation filaments used to form or modify thin film deposits and substrates.
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Optical Lenses -
(329 companies)
Optical lenses are transparent components made from optical-quality materials and curved to converge or diverge transmitted rays from an object. These rays then form a real or virtual image of the object. This area includes micro lenses.
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Industrial Coatings -
(1518 companies)
Industrial coatings are thin films deposited upon materials to add or enhance desired properties, such as color, conductivity, corrosion resistance, etc.
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Material Testing Services -
(844 companies)
Material testing services test, analyze, and certify a wide range of materials for purity, chemical compatibility, and environmental impact.
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Humidity Measurement Instruments -
(409 companies)
Humidity measurement instruments test for absolute humidity, relative humidity, or dew point in air
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Dimensional Measurement and Metrology Services -
(127 companies)
Dimensional measurement and metrology services use mechanical gaging, CMM measurement, non-contact imaging or other specialized methods to inspect and measure part dimensions and geometry
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Product Announcements for thickness wafer measurement
Product Announcements: 1 - 10 of 5046
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MTI Instruments Inc.
Wafer Measurement System from MTI Instruments
Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates diameters 75 - 300 mm.
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MTI Instruments Inc.
Wafer Measurement System
ProformaTM AutoScan 200 - Fully automated wafer characterization system for measuring thickness, TTV, bow, warp, bulk resistivity, site and global flatness. The Proforma AutoScan 200 features pick and place robotics, laser cassette scanning, auto-sensing cassette stands for wafers 75 - 200 mm diameter, and a modular design for easy upgrades.
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MTI Instruments Inc.
Semiconductor Wafer Thickness Gage
Proforma 300/G - Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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MTI Instruments Inc.
Non-Contact Wafer Thickness Gage
The Proforma 300 TM wafer thickness gage can be used to measure thickness, bow and TTV on all wafer materials including: silicon,gallium-arsenide,indium phosphide and germanium without recalibrating or electrically grounding the wafer.
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Fischer Technology, Inc. / Coating Thickness Gages
Coating Thickness Measurement - PHASCOPE® PMP10:
PHASCOPE® PMP10: Measure Copper Coating Thickness better with Eddy Current User-friendly, reproducible, accurate measurement of copper thicknesses using the phase-sensitive eddy-current method.
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Fischer Technology, Inc. / Coating Thickness Gages
Coating Thickness Measurement Bench Top Units
FISCHERSCOPE® MMS® PCB: Three in one instrument A universal measurement system for pc-boards measures the thicknesses of solder resist coatings as well as copper on surface areas and in boreholes.
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MTI Instruments Inc.
Wafer Metrology Measurement Tool
The Proforma 300SA is a semi-automated tool for measuring wafer bow, warp, flatness and stress.
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Fischer Technology, Inc. / Coating Thickness Gages
ISOSCOPE® MP30E-S Coating Thickness Measurement
The newly redesigned ISOSCOPE® MP30E-S Coating Thickness Gauge measures coatings over non-ferrous substrates such as aluminum, stainless steel or zinc using the eddy current method. Any assortment of coating thicknesses can be measured with the ISOSCOPE® MP30 Coating Thickness Gauge due to the wide range of smart probes available with this instrument. (read more)
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Browse Thickness Gages Datasheets for Fischer Technology, Inc. / Coating Thickness Gages
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Precitec, Inc.
Distance and Thickness CHRomatic Sensor--CHR 150 E
With thickness and topographical measurement speeds up to 1000 measurements per second, CHR 150 E is the low cost, high performance solution to non-contact inspection problems.
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Fischer Technology, Inc. / Coating Thickness Gages
DUALSCOPE® MP0R USB Coating Thickness Gauge
DUALSCOPE® MP0R USB Coating Thickness Gauge: Precise measurement - displayed twice! When measuring coating thicknesses, obtain measurement data with confidence through two displays on the portable instrument.
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Other Topics You Might Be Interested In
Interferometric microscopes use the interference patterns of light waves for precise determinations of distance, thickness, surface or step heights, wavelength, roughness and non-contact 3D surface...
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Vision systems for wafer and thin-film instrumentation include specialized optical instruments such as microscopes or imaging, CD resolution, defect detection and classification, surface roughness,...
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Atomic force microscopy (AFM) is being used in a great variety of force measurement applications, including investigating the unfolding pathways of native membrane proteins2, probing the structure of...
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Tools & Useful Links for thickness wafer measurement
Tools & Useful Links: 1 - 6 of 6
Engineering Web: thickness wafer measurement
1 - 10 of 808,277
metrology thickness wafer
... in a smallpatterned wafer. A. Thickness Metrology Module.. Staff The Trajectory TA[sup.3] integrated metrology module (IMM) measures film thickness, n and k, with a 2 sec/wafer measurement cycle. It ...
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New Products
... The Columbus wafer nanotopography measurement system provides fully interactive silicon wafer metrology for high-resolution analysis of nanotopography, wafer shape, flatness, and thickness from a ...
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SEMICON West Preview
Wafer Measurement The 9530-NT Ultragage is said to measure 8,700 data points in less than 60 seconds to provide the precision required for measuring thickness and shape, and for calculating stress. ...
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Integrated dielectric trench-depth measurement for dual damascene
... thickness, 2, and the low-k film thickness, T, were obtained: 2 = 1 D3 = D1 D2 D3 (2) T = D3 D4 (3) Die locations and measurement sites on Wafer 2 are shown in Fig. 2b. The half-moon wafer piece was ...
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New Products
Nondestructive wafer measurement By employing FTIR metrology combined with advanced optics and model-based analysis, FilmExpert provides nondestructive measurement directly on production wafers in ...
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Process development based on copper and low-<I>k</I> dielectric metrology
... on this 200mm wafer was evaluated by doing a wafer map with a 10mm edge exclusion zone using a production SE system. In order to avoid correlations in this multilayer measurement, the thickness of the ...
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Product panorama/Product news
The system provides in situ multipoint temperature measurement to within 2mm of the wafer edge under high-density plasmas from -60 to 420°C. Measurement accuracy is ±1°C below 130° ...
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Using broadband reflectometry for fast trench-depth measurement
As an example, we looked at a 200mm oxide covered silicon wafer etched with ~1.2µm-deep trench structures. The trench depth and mesa oxide thickness distributions across the wafer were determined ...
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Wafer thickness measurement: View
Wafer thickness measurement. Equipment. Contact us Search Comment on this page . ...
See MEMS and Nanotechnology Exchange Information
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Metrology: Quick and dirty Tevet style
... you have a small spot size to measure thickness," Wasserman told WaferNews. "Tevet has a large spot size - almost the whole chip." He said that the wafer is placed under a measurement head and all the ...
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