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Product Categories for wafer gripper
Thin Film Equipment -
(238 companies)
Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation.
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Property Testers -
(167 companies)
Property testers are used to determine various physical properties of samples, including distillation, vapor pressure, and cloud, flash, freezing, melting, or pour point.
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Chucks -
(295 companies)
Chucks are attachments used to hold a workpiece or cutting tool on a machine tool. This product area covers a variety of chuck types, including: clamping, collet, core, diaphragm, draw bar, electrostatic, fixturing, gear, grinding, lathe, magnetic, milling, pull down, roll, safety, scroll, speed, spindle, universal, vacuum and woodworking chucks.
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Gripper Products -
(12 companies)
Gripper products are used in fixtures to hold a component in place by providing resistance by friction or slight surface penetration. The face of the gripper may be serrated or flat and made of steel, carbide, or a plastic material
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Grippers -
(174 companies)
Grippers activate jaws or fingers to pick up, hold, or move work pieces in an automated or robotic system
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Wafer and Thin Film Instrumentation -
(258 companies)
Wafer and thin film instrumentation includes quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, and C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing
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Finishing Compounds -
(177 companies)
Finishing compounds are used to improve surface finish or flatness. They often consist of fine abrasives in slurry, bar, powder or paste forms.
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Semiconductors and Semiconductor Materials -
(188 companies)
Semiconductors (metalloids) or semiconductor materials are used to fabricate microelectronic and optoelectronic devices such as transistors, photodetectors or solar cells.
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Semiconductor Metrology Instruments -
(106 companies)
Semiconductor metrology instruments such as wafer probes, imaging stations, ellipsometers, CD-SEMs, ion mills, C-V systems, and diffractometers are designed for wafer and thin film in-line inspection after semiconductor processing
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Vacuum Manipulators -
(31 companies)
Vacuum manipulators include components for moving or positioning wafers or items in vacuum chambers or systems such as mounting devices, load locks, wobble sticks or wafer robots
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Sapphire Materials and Components -
(51 companies)
Sapphire materials and components consist of a single-crystal, ceramic form of aluminum oxide. They have superior hardness, mechanical and optical properties, and are used in jewel bearings, lasing rods, wear parts, wafer substrates and optics
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Semiconductor Cluster Tools -
(55 companies)
Semiconductor cluster tools and equipment are used to process semiconductor wafers for the production of microelectronic components
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Semiconductor Foundry Services -
(174 companies)
Semiconductor foundry services suppliers design and manufacture semiconductor chips on a contract basis, in prototype to production quantities.
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Cutoff Wheels and Abrasive Saw Blades -
(335 companies)
Cut-off wheels and abrasive saw blades are used to cut bars, stock, pipes and other materials that are made of metal, concrete, or masonry.
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Industrial Ceramic Materials -
(320 companies)
Industrial ceramic materials are non-metallic, inorganic compounds that include oxides, carbides, or nitrides. They have high melting points, low wear resistance, and a wide range of electrical properties.
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Engineering Web: wafer gripper
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Product News
... one for flipping and one for the wafer gripper mechanism. A 180 rotation of the wafer can be performed in 2 sec. The flipper is designed so that no particles (0.10.m) are detected in the wafer path ...
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Novel technology for handling very thin wafers
... the wafer onto the gripper surface. The wafer is fixed to the gripper by the suction force of vacuum pads. In our test, we have shown that the combination gripper handles thin wafers essentially flat ...
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Wafer gripper
Application Publication Date: Patent Publication Date: 12/23/1997. A wafer gripper assembly comprises first and second gripping members movably supported relative to each other. A motor propels the ...
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Interferometric Metrology for Thin and Ultra-Thin Compound Semiconductor ...
... wafer gripper having thickness points. Origin of our system of coordinates resides at the significantly smaller than coherence length of radiation used center of the wafer. Flat of the wafer resides ...
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WAFER GRIPPER
A wafer gripper assembly (12) comprises first and second gripping members (14) for movably supported relative to each other. A motor (26) propels the gripping members linearly towards and away from ...
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Flipper puts wafers in the frame: News from Owens Design
The Wafer Flip Module has two motors, one for flipping and one for the wafer gripper mechanism.. A 180-degree rotation of the wafer can be performed in less than 2s.. The flipper is designed so that ...
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Evaluation of Handling Stresses Applied to EFG Silicon Wafer using a Bernoulli ...
The objective of this work is to develop an understanding of the influence of gripper variables and silicon wafer characteristics on wafer deformation and stresses in order to prevent wafer breakage ...
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Ultrasonic wafer transport technology seeks partners
... gripper. The gripper picks them up without touching their surface by a counterbalancing combination of vacuum and ultrasonic forces.In fact, the gripper does touch the edge of the wafer, as do the ...
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Method and apparatus for transferring wafers invention
... wafer chuck to meet the wafer after the wafer, lowering said wafer chuck with said wafer thereon for processing, raising said wafer chuck to said gripper arms after processing is completed, and ...
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Method and apparatus for transferring wafers invention
... wafer from the gripper onto the planar surface, processing the released wafer, re-gripping the released wafer after the processing with the gripper on the wafer perimeter, rotating the gripper about ...
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