Etched Foil Heaters, for the Semiconductor & Wafer Processing industry, from Thermal Circuits. In the early 1980's, Thermal Circuits introduced HTB etched foil element heaters to the Semiconductor industry to heat acid in portable wafer processing baths. It replaced hot plates that only heated from the bottom. (read more)

Nook's Universal-Mount with motor mount includes an EZZE-MOUNT block with a motor mount for easy, accurate installation of ball screw and acme screw assemblies. Universal-mount bearing supports have two precision mounting surfaces. Mounting holes are pre-drilled for face or foot mounting. (read more)

Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness. The Proforma 200SA can be used for all wafer materials and accommodates diameters 75 - 300 mm. (read more)

Rogue Valley Microdevices offers PECVD Silicon Carbide (SiC), which is a single side deposition. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining of your finished wafers. We are able to process wafer diameters of 50mm up to 300mm. (read more)

Rogue Valley Microdevices is pleased to offer PECVD Silicon Carbide. This highly durable thin film can be deposited alone or within stack of PECVD Oxide and/or Nitride films. PECVD Silicon Carbide is the perfect choice for use as a hard mask for bulk micromachining. Rogue Valley Microdevices process all wafers and films in-house at our Medford, Oregon facility. (read more)

Rogue Valley Microdevices offers Dry Thermal Oxide. Our ultra pure Dry Oxidation process is available for those applications requiring thinner oxides. We offer Chlorinated and Non-Clorinated Dry Thermal Oxide. Using Dry Chlorinated Thermal Oxide can help your devices perform to their highest potential by eliminating metal ions. (read more)

Silicon Wafers - Because of our ability to process all wafers diameters (50mm-300mm) Rogue Valley Microdevices maintains a diverse inventory for customers whom require either bare silicon wafers or silicon wafers with Thin Films. Our ability to provide you with both thin films services and silicon wafers can help reduce cycle time as well as shipping cost. (read more)

Silicon Wafers - Because of our ability to process all wafers diameters (50mm-300mm) Rogue Valley Microdevices maintains a diverse inventory for customers whom require either bare silicon wafers or silicon wafers with Thin Films. Our ability to provide you with both thin films services and silicon wafers can help reduce cycle time as well as shipping cost. (read more)

Rogue Valley Microdevices can process at our in-house facility in Medford Oregon silicon wafers, 50mm-200mm with LPCVD Nitride. You can order LPCVD Nitride as thick as 5μm or as thin as 100Å! Low Stress LPCVD Nitride is an excellent film for building Membranes, Cantilever Beams and other mechanical structures. (read more)

Rogue Valley Microdevices provides PVD Metals including sputtered Copper, sputtered Tantalum, sputtered Titanium, sputtered Tungsten, sputtered Nickel, sputtered Chrome, and sputtered Aluminum. Our process has an in-situ RF etch that ensures good film adhesion and Ohmic contact to conductive layers. We can provide the metal barrier layers and dielectric films on wafers sizes 50mm to 300mm. (read more)