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Thin Film Equipment

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About Thin Film Equipment

Thin film equipment is vacuum process equipment for the deposition or modification of thin films or surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation.  Thin film equipment is widely applied in the semiconductor or wafer processing, cutting tool coating and optical films.

Coating systems types of thin film equipment are batch systems (single chamber or multiple wafers), cluster tool (multi-chamber or single wafers), factory or free standing, and laboratory or benchtop.  Batch systems can pass several wafers or samples simultaneously through in a single process, usually in a single chamber.  An oxidation furnace is an example of a batch processing system.  Some batch systems also have the capability to apply several processes simultaneously.  Cluster tools consist of multiple chambers for different processes.  The cluster tool usually has a central robot to feed multiple process chambers. Cluster tools are commonly used to perform multiple process steps on a series of single wafer or samples and therefore may improve process control and cycle time compared a batch processor.  Factory or freestanding systems are large, floor mounted vacuum deposition systems designed for high volume factory use or processing large components.  Laboratory systems are small, bench top mounted vacuum deposition systems designed for low volume experimental or analytical applications.  Sputter coaters for SEM or TEM preparation would fall into this category.

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