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Wafer and thin film instrumentation is designed for wafer metrology or the in-situ monitoring of thin-film parameters during wafer processing. Capacitance or electromagnetic (EM) gauges use field measurements to determine the thickness of thin films or substrates. Capacitance-vs.-voltage (C-V) systems determine semiconductor parameters such as carrier life. Discrete wavelength ellipsometers and spectroscopic ellipsometers use the reflection of polarized light from a surface to measure film properties. Quartz crystal microbalance (QCM) monitors use a vibrating quartz crystal to measure thin-film deposition rates. Interferometers measure distances in terms of wavelength. Profilometers, scanning probe microscopes (SPM), and atomic force microscopes (AFM) measure surface roughness at the atomic level. Reflectometers and radiometers measure surface reflectivity and radiance. Four-point resistance probes measure the electrical resistivity of thin films to determine carrier concentration. Magnetometers measure magnetization and magnetoresistive properties. Reflection high-energy electron diffraction (RHEED) instruments measure or monitor the crystal structure or crystal orientation of epitaxial thin films. Optical and imaging systems measure surface roughness, gage thickness, and detect defects. Source measurement units (SMU) interface with automated test equipment (ATE). X-ray diffractometers are used to determine crystal structure, crystal orientation, film thickness, and residual stress.

Selecting wafer and thin film instrumentation requires an analysis of measurement capabilities. Some devices measure adhesion, composition, deposition, dielectric properties, residual stress, or trench geometry. Other devices measure dopant levels, electrical resistivity, magnetic properties, or particle contamination. Products that measure surface roughness, thickness and waviness are commonly available. Automatic defect classification (ADC) instruments detect residual traces of films or patterned conductor flaws. Probing instrumentation is used to perform the parametric or in-line testing of electrical gates, and to sort or mark wafers based on electrical performance. Wafer and thin film instrumentation such as ellipsometers are used to measure the optical constants, refractive indexes, and extinction coefficients of thin films or optical components. Wafer and thin film instrumentation with area mapping, depth profiling, and endpoint detection is also available.


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Endpoint detection of plasma etching, CMP, or other processes usually occurs through spectral analysis of the plasma, precursor gases, or thin film layers. In plasma etching, endpoint detection is... (Read More)
Structure or residual stress instruments are capable of discerning microstructural, chemical bond type, or structural features of wafer or thin film deposits. Microstructural features include phase... (Read More)
Vision systems for wafer and thin-film instrumentation include specialized optical instruments such as microscopes or imaging, CD resolution, defect detection and classification, surface roughness,... (Read More)

Engineering Web: Wafer and Thin Film Instrumentation
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Nova Measuring Instruments, Inc. - Company Profile
Search other manufacturers in the following categories: Semiconductor Cluster Tools Thin Film Equipment Wafer and Thin Film Instrumentation Home   |.   About GlobalSpec   |.   Media Kit   |.   Site  ...
Electrostatic Instrumentation - TREK Company Profile
Wafer and Thin Film Potential Measurements. Trek’s non-contacting electrostatic voltmeters are used to precisely measure the surface potential of semiconductor wafers and the voltage, which ...
See TREK, Inc. - NY Information
Literature Update
Thin-film coating brochureA six-page, full-color brochure highlights a line of standard and custom thin-film coatings that cover the wavelength range from ultraviolet to near infrared. Graphs and ...
United Kingdom vacuum pump manufacturers and vacuum system suppliers
Valves, Pressure Measurement, Thin Film Instrumentation, Motion, Accessories, Custom Fabrication. company profile: LewVac is a UK-based supplier of HV and UHV components to the vacuum technology ...
Emerging U.S. Flat Panel Display Industry Embraces Automation
The Thin CRT displays use the same photolithography, thin film and etch systems as AMLCD, but use fewer of them, and are less sensitive to defects in some processes.One-third of the company`s ...

Part Numbers for Wafer and Thin Film Instrumentation

Part # Distributor Manufacturer Product Category Description
AL110-6   Olympus Surgical & Industrial America, Inc. Wafer and Thin Film Instrumentation High throughput, class 10 compatible, 100% backside inspection
AL110-8   Olympus Surgical & Industrial America, Inc. Wafer and Thin Film Instrumentation High throughput, class 10 compatible, 100% backside inspection
VMR-C4540   Nikon Instruments Inc. Wafer and Thin Film Instrumentation FOUP, FOSB, OC compatible carriers, episcopic, diascopic, darkfield
AL110-86   Olympus Surgical & Industrial America, Inc. Wafer and Thin Film Instrumentation High throughput, class 10 compatible, 100% backside inspection
MX61   Olympus Surgical & Industrial America, Inc. Wafer and Thin Film Instrumentation Space saving, ergonomic design, ready for digital imaging

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