Coating equipment or systems where the entire part is dipped into a tank filled with the paint or coating media and then excess coating is removed by spinning the part. Bulk painting of small and unchangeable parts is accomplished by dipping a mesh basket of parts, followed by rapid rotation of the basket to remove excess paint. Parts from the dip-spin coater are dumped onto a conveyor belt for curing.
In chemical vapor deposition (CVD) processes, a precursor gas or mixture of gases is fed into a chamber and reacted with an energy source (usually heat) to form thin film coatings. CVD processes are useful in the deposition of dielectric films such as oxides and nitrides. The energy or heat source may be a plasma, substrate induction, or resistance heater.
In curtain coaters, flow coaters, trickle coaters or cascaders, paint or liquid coating media is poured forming a waterfall, narrow stream or sheet through which parts or stock materials are passed. Precise, narrow streams are used to selectively apply coating, primers or adhesives only portion of a part's surface.
Coating equipment or systems where the entire part is dipped into a tank filled with the paint or coating media and then excess coating drip off the part falling back into the tank.
E-coat, electrocoat or electrophoretic coating use the charging of particles to attract paint or coating particles or molecules in an immersion bath to the surface of a submerged part. E-coating is a dip coating process where the coating or paint solids suspended in the bath are given an electrical charge, which is then attracted to the part. In a method closely paralleling electroplating, paint is deposited using direct electrical current. The electrochemical reactions that occur cause water-soluble resins to become insolubilized onto parts that are electrodes in the E-coating paint tank. Subsequent resin curing is required. E-coat processes are also referred to as electrocoating, electrodeposition, electronic coating, e-painting, electronic painting, electro coating, electrophoretic coat and electrophoresis coating.
In electrostatic coating, paint droplets or coating powder particles are charged and then sprayed toward a part with an opposite and attractive electric charge. The spray process may be airless or air assisted.
In fluidized bed systems, air is blown up through a porous bed or screen to suspend coating particles thereby forming a fluidized bed. Hot parts are inserted into the fluidized bed allowing the powder coating particles to stick onto the exposed surfaces.
Impregnation equipment uses vacuum, pressure and/or wicking action techniques to drive resins or coating materials into parts. In trickle impregnation systems, surface tension effects allow resins to be wicked or soaked up by the internal porosity of a part (like a sponge soaking up water). In vacuum-pressure impregnation equipment uses vacuum and/or pressure to drive resins or coatings into a surface after a dip or trickle coating. Impregnation equipment is designed for sealing, filling or impregnating the porous surfaces of metal castings, stator windings, transformers or open porosity powder metal parts. Impregnation of P/M parts improves integrity and corrosion resistance. Impregnation of electrical or electronic components can provide electrical insulation as well as environmental protection.
Thin film processes use a liquid phase such as electrochemical deposition, liquid phase epitaxy, electroless plating and electroplating and electrophoretic deposition.
Physical vapor deposition processes form thin film layers through evaporation or sputtering (glow discharge processes) of atoms from a source and then condensing or depositing the material onto the surface, substrate, wafer or part.
In powder coating systems, protective or decorative coatings are formed by application of powder to a substrate, after which the powder is fused into a continuous film by the application of heat or radiant energy. Powder coatings are finely divided particles of generally containing organic polymer or binder, pigments, fillers, and additives. In a fluidized bed powder coating process, hot parts are introduced and the powder coating particle stick or fuse onto the part's surface. In electrostatic powder coating systems, the particles are given an electric charge that causes the particles to be attracted to an oppositely charged part.
In spin coating, a thin coating of resin, often a photoresist, is poured onto the surface of the spinning part, typically a silicon wafer or substrate. The spinning coating process provides a very thin layer or controlled thickness across the surface, which is important for photolithography type applications.
A coating process using wet spray paint or fluid coating media where a spray gun directs a coating or paint aerosol toward the part's surface. The paint or coating aerosol is formed using a rotary (spinning disc or bell) atomizer, an ultrasonic atomizer or by forcing the media through a nozzle with pressure.
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A PVD process using induction heating to vaporize the material to be deposited on the substrate. Material in a crucible surrounded by an induction heating coils is heated by inducing a current in the material.
A PVD process using a laser beam or plasma source to vaporize the material to be deposited on the substrate. Evaporation by a laser source is sometimes called Physical Laser Ablation (PLD). Evaporation by a plasma source is referred to as Ion Plating.
A PVD process using resistance heating to vaporize the material to be deposited on the substrate. Passing current through the tungsten filament or element heats material on a tungsten filament or in a crucible surrounded by the resistance-heating element.
A PVD process using plasma (glow-discharge) to ionize or knock (sputter) atoms off a target (source material) and deposit the positively charged ions on a substrate or wafer. The DC power source results in metal target with a negative bias and a substrate with a positive bias causing unidirectional plasma current from the wafer to the target.
In DC or RF Magnetron sputtering, powerful magnets placed behind the target and sometimes around the plasma field provide several enhancements to the sputtering process such as trapping electrons that would cause ancillary heating of the chamber, forming a stable plasma discharge at lower pressures, directing additional ions at the substrate and confining the plasma away from the wafer or substrate.
Ion beam sputtering utilizes an ion beam to liberate and ionize atoms from the target material, which are then deposited on the substrate. The beam, target material and substrate are not electrically coupled as in the conventional DC and RF sputtering processes.
A PVD process using plasma (glow-discharge) to ionize or knock (sputter) atoms off a target (source material) and deposit the positively charged ions on a substrate or wafer. The high frequency, alternating current (AC) or radio frequency (RF) power source can provide a forward (positive) or reverse (negative) bias. In DC sputtering, only positive sputtering occurs. The negative sputtering or is useful for sputtering cleaning or ion milling of the substrate prior to deposition.
Ion beam assisted deposition (IBAD) is a PVD deposition that uses an ion beam directed at vaporized atoms or ions to deposit material. The beam, source material and substrate are not electrically coupled as in the sputtering process. Ions (Ar, N, O) are produced in a separate chamber and then directed at atoms of the coating material are liberated by evaporation, sputtering, or another process. The ion beam ionizes or boosts the energy level of some of the coating atoms, which are then deposited on the substrate.
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A blast or jet machine part or component that can be used to build a system or replace a worn or broken component.
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The gun or applicator directs a stream of paint droplets, coating powder or adhesive through a nozzle or opening, at the appropriate region of the workpiece.
Rooms or booths are used when processing larger workpieces. Rooms contain the painting or coating equipment, the workpiece and the operator. Booths usually contain internal lighting, ventilation and recovery systems. The operator may operate the spray gun in offhand mode or the gun may be reciprocator mounted. The workpieces often rest on open grid flooring that allows used paint or powder coating to drop through for recycling.
Tanks are used in dip coating, immersion painting, e-coating or dip-spin processes. Plastic or metal tanks are used depending on the specific process chemistry.
Integral or optional ovens, dryers, infrared heaters, immersion heaters or other heating components for drying off or pre-heating part surfaces before coating, curing coatings or thermally reduce liquid resin viscosity. Thermal heating or curing systems can use infrared, RF, combustion, induction or resistance heating technologies.
Distribution or dispensing units that are used to control the rate that the coating media is fed into the applicator from the paint source. The component may consist of a valve, valve stack or manifold or electromechanical feeding system. Depending on the coating technology, the coating media may be in the form of powder, wire or liquid paint. Plural component coating systems have feeders or fluid handling components that will meter, mix and control the ratio of two or more different components.
Coating system that can deposit multiple materials sources either simultaneously or sequentially within the run cycle. The systems may have a turnstile containing several different sources or materials.
The pump, compressor or pressure generator increases the pressure of the carrier fluid or propellant (typically air) or directly pressurizes and moves the paint or liquid coating. In air spray systems, air compressors are typically used to generate pressure.
Reciprocators, oscillators and robotic arms can uniformly paint or coat a surface by scanning a surface in a controlled and repeatable fashion. Coating or spraying equipment mounted on crawlers or robotic arms may also find use in hazardous situations such as in containment of toxic materials, extreme environment conditions or in hard to reach places (tower, tank walls, ship hulls, etc.) with associated fall hazards. Reciprocators and robotic arms are also used in dip coating processes to immerse and withdrawn the part from the dip tank.
Separators or reclaimers remove undersized powder, media and coarse waste. Reclaimed material can sometimes be recirculated back into the coating process if the media's particle size and coating characteristics still meet specifications.
Production tunnels consist of long walk-in enclosures containing continuous processing lines and systems for cleaning, coating, drying or curing and conveying or material handling.
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Machine or system is automated, is an inline system or operates continuously with little or no operator intervention. Common types of automated units are cluster tools, inline systems, or continuous web units.
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The machine is small enough or has features for mounting on a bench, table top or pedestal. Semiconductor wafer spin coaters, laboratory dip coaters, and other research coaters are often bench mounted.
The machine can be mounted on the floor or a skid in a freestanding position. Typically, these units are meant to located and remain stationary in a position in a plant, shop, production line or cellular manufacturing system.
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