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Dimensional measurement and metrology services use mechanical gaging, CMM measurement, non-contact imaging or other specialized methods to inspect and measure part dimensions and geometry.
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Form gages and form gaging systems are used to inspect parameters such as roundness, angularity, squareness, straightness, flatness, runout, taper and concentricity.
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Imaging workstations are vision systems used for metrology or image analysis in laboratory and cleanroom settings.
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Interferometers measure distance in terms of wavelength and determine the wavelengths of light sources.
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Optical and optoelectronic assembly services companies design assemblies and systems for optical and optoelectronic devices.
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Optical and optoelectronic design services assist with the initial conception and design of an optical or optoelectronic device or assembly.
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Optical coating services design optical coatings and apply them to crystal, fiber, glass, metal, or polymer substrates to produce optical components.
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Optical lenses are transparent components made from optical-quality materials and curved to converge or diverge transmitted rays from an object. These rays then form a real or virtual image of the object. This area includes micro lenses.
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Optical manufacturing services design, fabricate, finish and test optical components and optical elements.
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Optical polarizers are optical devices that can transform unpolarized or natural light into polarized light, usually by the selective transmission of polarized rays.
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Product and component testing services is the evaluation of a finished product or component through performance in electrical, life, environmental exposure, dynamic, ergonomic or other specialized tests. Also testing to standards such as UL 489, CE or MIL-STD 810.
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Product training is performed by suppliers to teach customers how to use purchased products. Third-party training is not included in this area.
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Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.
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Specialty microscopes are designed for specific applications such as metallurgy or gemology. They use specialized techniques or technologies such as acoustics to produce magnification.
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Surface metrology equipment is used to measure the surface finish and/or geometry of engineering components. Surface texture and topology characteristics include surface roughness, contour, form, waviness and defects.
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Surface profilometers are contact or non-contact instruments used to measures surface profiles, roughness, waviness and other finish parameters.
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Thin film coating services apply very thin layers of specialized materials to part surfaces. They perform processes such chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, electrochemical deposition (ECD), plasma etching, rapid thermal processing (RTP), and titanium nitride coating.
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Wafer and thin film instrumentation includes quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, and C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing.
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